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1. 2 Layer CEM-3

Layer: 2L

Base Material:CEM-3 CTI300

Board Thickness: 1.6mm

Final copper: 35um

Surface Finish: Immersion Tin/Sn

Solder mask: Green

Silkscreen: white

Profile: Routing + v-cut

E-test: 100% Fixture

2. 2 Layer FPC

Layer: 2 layer
Materials: PI
Copper Thickness: 35um
Min Board Thickness: 0.1mm
Surface coating: HAL, HAL LF, Immersion Gold, Immersion Tin, Immersion Silver
PI thickness: 1/2mil, 1 to 10 mil
ADH thickness: 1/2mil, 1mil
FPC, flexible ...

3. 6 Layer I/G, Impedance PCB

Specification: 6L

Material: FR-4 TG170

Board thickness: 1.6mm

Final copper: 35um

Solder mask color: Blue

Surface Finish: Immersion Gold, Au:3u" min. Impedance control

Profile: Routing

E-test: 100% Fixture

Quality ...

4. 10 Layer Gold fingers PCB

Layer: 10L
Base Material:FR-4 tg180(ITEQ)
Board Thickness: 1.6mm
Final copper: 35um
Surface Finish:Immersion Gold/Au:2u" min. Gold fingers/Au:30u"
Solder mask: Green
Profile: Routing
E-test: 100% Fixture
Quality report: ...

5. 8 Layer Mobile PCB

Specification: 8L(1+6+1)

Material: FR-4

Board thickness: 1.0mm

Final copper: 18um

Solder mask color: Green

Silkscreen: White

Surface Finish: Immersion Gold

Profile: Routing and stamp holes

E-test: 100% Fixture ...