Shenzhen GSS PCB Technology Co., Ltd.

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1. 10层

10 layer printed circuit board for telecom

产品名称: 双面LED显示板
产品编号: AA0120L02
基材: FR-4
层数: 2层
厚度: 1.6mm
过孔孔径: 0.3mm
线宽: 3.5mil
线距: 4mil
镀层工艺: 镀金
产品说明: 高密度双面板,带邦定

2. 8层沉金pcb板

产品名称: 6层光通信转换模块板
产品编号: DN9948L06
基材: FR-4
层数: 6层
厚度: 1.2mm
过孔孔径: 0.3mm
线宽: 8mil
线距: 8mil
镀层工艺: 喷锡+金手指
产品说明: 长短金手指,金手指要求40微英寸外形要求非常严格

3. 10 layer print circuit board

Base Material: FR-4
Layers: 8
Thickness:1.6mm
Cross hole aperture: 0.25mm
line width: 5mil
line distance:5mil
plating process: Gold immersion
Description:PC104 process control embedded mainboard

4. 8 layer pcb

产品名称: 16层电源厚铜箔盲孔板
产品编号: AA0132L16
基材: FR-4
层数: 16层
厚度: 4.0mm
过孔孔径: 1.0mm
线宽: 12mil
线距: 15mil
镀层工艺: 沉金
产品说明: 盲埋孔工艺,用于通信电源

5. 6 layer gold immersion pcb

Base Material: FR-4
Layers: 6
Thickness: 1.0mm
Cross hole aperture: 0.25mm
line width: 5mil
line distance:5mil
plating process: Gold immersion
Description: Mainboard of digital products

Capacity:
1.Layers:1~24L
2.Material: FR-4,Rogers 4003/4350, ,CEM-1,Teflon,Taconic,Berquist
3.Max Size: 640*1100 mm
4.Board Thickness: 0.2mm~6.0m
5.Min. Trace space: 3mil
6. Min line width/space : 4/4mil(1mm), 3mil(0.75mm) partially
7.Cooper Thickness: 0.5~6.0OZ
8.Surface finishing: HAL lead free, immersion gold, Immersion silver, Chemical tin, OSP, Gold plating, Gold finger, Peelable mask, Carbon ink
9.Solder mask: Wihte, Black, Blue, Green,Yellow, Red
10.E-Test: 100%test
11.Delivery time: 3~15days
12.Quality &Certificate: UL , RHOS, ISO 9001:2000, ISO 14000
13.Special requirements: Buried and blind vias+controlled impedance +BGA
14. provide OEM services to all sorts of printed circuit board assembly as well as electronic encased products
15.Payment: T/T
16.Shipment: DHL, UPS, TNT & Air shipment & Ocean shipment, as your request.
17.Packing: Vacuum& Carton