Shenzhen Sun&Lynn Circuits Co., Ltd

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1. 8-layer PCB with Blind/Buried VIAs

8-layer PCB
8-layer PCB with Blind/Buried VIAs, Unsymmetrical Laminated Stackup Technique
Key Specifications/Special Features:

Red color LPI solder mask
Minimum blind/buried VIAs hole size: 10 mil
Board thickness: 40mil
Surface finish: ...

2. Blue Color Solder Mask 4-Layer PCB

Key Specifications/Special Features:

Computer mainboard
Surface finish: HASL
Impedance tolerance: +/-10%
Minimum drilling hole size: 16mil
PTH hole diameter tolerance: 3mil
NPTH hole diameter tolerance: 2mil
Hole position deviation: ...

3. 14-Layer High Reliability PCB

Key Specifications/Special Features:

FR4
Surface finish: immersion gold
Board thickness: 140mil
Base copper thickness: 3oz
PTH hole diameter tolerance: 3mil
NPTH hole diameter tolerance: 2mil
Hole position deviation: 2mil
Outline ...

4. High Density SMT 14-Layer Board

Key Specifications/Special Features:

Aspect ratio: 8:1
Minimum line width/space: 5mil
Minimum drilling hole diameter: 8mil
NPTH hole diameter tolerance: 2mil
PTH hole diameter tolerance: 3mil
Hole position deviation: 2mil
Outline ...

5. 12pcs Per Step Thin PCB

Key Specifications/Special Features:

For mobile phone camera
Bond pull force: > 8g
Gold thickness: > =5 microinches
Nickel thickness: > =150 microinches
Minimum drilling hole diameter: 8mil
Board thickness: 16mil (4 layers) ...